Profile cutting machine manufacturer, Techserv, has developed the most compact dual purpose cutting machine on the market.
The plasma and gas cutting machine has a unique foldaway design which compacts down to 2.5m2 [metres squared] for storage purposes. The Techserv machine also has slots to enable a fork truck to lift and place it out of the way.
Mike Cowley, Techserv’s managing director, said the small machine is capable of cutting both thick material weighing several tons using its gas cutting technology and very thin material using its plasma cutting system.
This is the most compact and affordable cutting machine on the market
Mike Cowley – Techserv